Version 7.2

The bootable version of the Intel® Processor Frequency ID Utility is available in .exe format. This download does not work in DOS-emulation windows, as found in operating systems such as Linux*. Since this version is bootable, it does not depend on any specific operating system (OS independent).

See the Installation Guide for detailed instructions on how to use this utility.

Which Utility Should I Use?
For Intel® Pentium® III processors, and processors manufactured before the Intel® Pentium® III processor, use the Intel® Processor Frequency ID Utility.

Version 7.2

The utility is available for download in a self-installing .msi file format.

• Supported Processors
• Supported Operating Systems

• Proper Intel® processor brand identification
• Processor and system bus expected frequencies
• Processor and system bus reported frequencies
• Accompanying this information is a message informing the user whether the processor is operating at its expected frequency
• Which processor was tested in a multiprocessor system, and total number of processors (Windows* XP, and Windows* 2000 only)

The CPUID Utility for Windows* is incorporated into the Intel® Processor Frequency ID Utility.

Use the CPUID Data Screen of the utility to identify Pentium® processors and higher.

• Windows 98* SE
• Windows 2000* Professional, Server, Advanced Server
• Windows Me*
• Windows XP*

This utility is designed to identify current Intel® Processors and technologies, and enables you to run and save a processor ID report. The utility also features a frequency test to make sure that the processor is working at the tested and rated speed.

The Intel® Processor Identification Utility video walks you through download to installation, and provides an overview of the most common technologies supported by the processor.

The latest version of Intel® Processor Identification Utility is available for download in a self-installing .msi file format.

• Determine if the system worked before. Determine if there have been any recent changes. Often if a recent change is been made, the recent change is the cause of the problem.
  
  
• Check to see if your system feels warm and check the processor for overheating. NOTE: Use extreme caution when checking for heat, since you can be easily burned.
  
  
• Make sure that the power supply fan is running properly and any other external case fans are running properly. Make sure that the air intakes for the external fans are unobstructed and have at least several inches away from walls and other items.
  
  
• Make sure the fans on the processor are connected properly and running.
  
  
• Make sure that the thermal interface material or the thermal grease is applied properly.
  
  
• Disable thermal measurements and power saving features in the BIOS setup program.
  
  
• Update the system BIOS to the newest version. In addition, check to see if your system has a firmware that could also be updated to the newest version. Refer to your motherboard documentation.
  
  
• Check the BIOS using the BIOS/CMOS setup utility, particularly the boot order. Make sure that your system is detecting all of the drives and make sure that the drive you are trying to boot is listed.
  
  
• Do not overclock your system. Your system can become unreliable, may shorten the life of your PC components, may damage your PC components and may void your warranty.
  
  
• Check the BIOS using the BIOS/CMOS setup utility, especially the RAM settings.
  
  
• Suggest running ScanDisk to see if your hard drive has a lot of lost clusters and other anomalies. If you don't properly shutdown your computer using the Start button shutdown option, you may see some lost clusters and possible bad clusters.
  
  
• Suggest running an updated virus checker to see if your system is affected by a virus.
  
  
• Suggest reloading the OS, drivers or program.
  
  
• Suggest reformatting the hard drive and reinstalling everything.
  
  
• Verify that your chassis/case and power supply is appropriate for the processor model and frequency and the motherboard you are planning to use.
  
  
• Verify that the power supply has the capacity to power all the devices used in your system. It is recommended to use at least a 200 W power supply, but may require a power supply with a higher capacity depending on the number of devices and the type of devices connected to your computer.
  
  
• Ensure the selected motherboard is appropriate for the processor model, frequency, and stepping you are planning to use. For more information, refer to the Motherboard Selection and Voltage Requirements section of the Integration Overview document.
  
  
• Check for foreign objects such as screws that may ground the motherboard and make sure the screws that hold the motherboard are not too tight.
  
  
• Make sure the power cables inside the computer are attached correctly and secure.
  
  
• Use a voltmeter to verify that each output from the power supply is correct. If any output is very low (especially the +5 volt output, replace the power supply).
  
  
• Use a voltmeter to verify the Power Good signal is +5 volts. If the signal is below 1.0 volts, there may be a short or overload causing a constant reset. Consider replacing the power supply.
  
  
• Check for shorts and overloads inside computer by removing nonessential items such as extra controller cards and IDE/ATAPI devices and turning the computer on to see if it starts to boot. Leave the motherboard, power supply, RAM or processor. If the problem goes away, there was a short or overload with one of the components that you just removed or one of those components is faulty. Replace each of those one at a time until you isolate which is causing the problem. If the problem still occurs after removing the nonessential components, the problem has to be with the motherboard, power supply, RAM or processor.
  
  
• Remove the processor and RAM and reinstall them to make sure that they are installed correctly.
  
  
• Make sure that you have mounted the motherboard correctly with the spacers/stand-offs. In addition, make sure that when you insert the screws to tighten the motherboard into place, make sure not to tighten the screws too much.
  
  
• If the problem still persists, swap the RAM with known good RAM. In addition, test the suspected RAM in another known working system.
  
  
• If the problem still persists, swap the processor with a known good processor. In addition, test the suspected processor in another known working system.
  
  
• If the problem still persists, swap the motherboard with a known good motherboard. In addition, test the suspected motherboard in another known working system.

• Determine if the system worked before. Determine if there have been any recent changes. Often if a recent change is been made, the recent change is the cause of the problem.
• Do not overclock your system. Your system can become unreliable, may shorten the life of your PC components, may damage your PC components and may void your warranty.
• Verify that your chassis/case and power supply is appropriate for the processor model and frequency and the motherboard you are planning to use.
• If applicable, verify the voltage settings for the processor.
• Verify that your thermal solution for the processor is adequate for the processor and frequency of the processor.
• Check to see if your system feels warm and check the processor for overheating. NOTE: Use extreme caution when checking for heat, since you can be easily burned. Many people may be running a software package or using their BIOS setup program, which is telling them the processor is running warmer than normal. Many times, these programs and/or BIOS setup programs may be wrong. Therefore, if you not feel a large amount of heat coming from the processor and heat sink, then the processor is probably not overheating.
• Make sure that the power supply fan is running properly and any other external case fans are running properly. Make sure that the air intakes for the external fans are unobstructed and have at least several inches away from walls and other items.
• Make sure that you have power cable for the fan connected to the correct fan header specifically for the processor. Refer to your motherboard documentation for more information.
• Make sure the fans on the processor are connected properly and running.
• Make sure that the thermal interface material or the thermal grease is applied properly.
• Disable thermal measurements and power saving features in the BIOS setup program.
• Update the system BIOS to the newest version. This will often correct problems with how the system measures the processor temperature.

• Determine if the system worked before. Determine if there have been any recent changes. Often if a recent change is been made, the recent change is the cause of the problem.
• Make sure the computer is plugged in and on.
• Make sure that the monitor is plugged in and on.
• Use a voltmeter or an AC wall outlet tester found in a hardware store to confirm that there is adequate AC voltage at the wall outlet.
• If your AC outlet is connected to an on/off outlet switch, make sure that it is on.
• Determine power supply voltage selector setting (230 volts vs. 115 volts) is correct.
• Ensure the selected motherboard is appropriate for the processor model, frequency, and stepping you are planning to use. For more information, refer to the Motherboard Selection and Voltage Requirements section of the Integration Overview document.
• Verify that your chassis/case and power supply is appropriate for the processor model and frequency and the motherboard you are planning to use.
• Verify that the power supply has the capacity to power all the devices used in your system. It is recommended to use at least a 200 W power supply, but may require a power supply with a higher capacity depending on the number of devices and the type of devices connected to your computer.
• Make sure the power cables inside the computer are attached correctly and secure.
• Make sure the drive ribbon cables inside the computer are attached correctly and secure. Be sure to check the orientation of pin 1 of Hard Drive. If the ribbon cable is connected backwards may cause the computer not to power up.
• Check for foreign objects such as screws that may ground the motherboard and make sure the screws that hold the motherboard are not too tight.
• Check the cables that connect from the case to the motherboard. Be sure to include the power switch (PWR SW) and power LED (PWR LED). Refer to the motherboard manual for more information.
• Use a voltmeter to verify that each output from the power supply is correct. If any output is very low (especially the +5 volt output, replace the power supply).
• Use a voltmeter to verify the PowerGood signal is +5 volts. If the signal is below 1.0 volts, there may be a short or overload causing a constant reset. Consider replacing the power supply.
• Check for shorts and overloads inside computer by removing nonessential items such as extra controller cards and IDE/ATAPI devices and turning the computer on to see if it starts to boot. Leave the motherboard, power supply, RAM or processor. If the problem goes away, there was a short or overload with one of the components that you just removed or one of those components is faulty. Replace each of those one at a time until you isolate which is causing the problem. If the problem still occurs after removing the nonessential components, the problem has to be with the motherboard, power supply, RAM or processor.
• Remove the processor and RAM and reinstall them to make sure that they are installed correctly.
• Make sure that you have mounted the motherboard correctly with the spacers/stand-offs. In addition, make sure that when you insert the screws to tighten the motherboard into place, make sure not to tighten the screws too much.
• Determine if motherboard/system has any security features, which would disable boot.
• If you are using RDRAM, make sure that all memory sockets of a channel are filled with either a memory chip or a continuity module. In addition, if the motherboard has multiple channels, make sure that you fill the first channel once and that you check to see which memory sockets go with each channel. Lastly, the RDRAM often has to be installed in pairs of the same type of memory chips. For example, you would have to install two sticks of 64 MB of RDRAM running at 800 MHz.
• If you are using SDRAM or DDR-SDRAM, some motherboards require you to populate the memory sockets starting with the first socket. Refer to your motherboard documentation for more information.
• If the problem still persists, swap the RAM with known good RAM. In addition, test the suspected RAM in another known working system.
• If the problem still persists, swap the processor with a known good processor. In addition, test the suspected processor in another known working system.
• If the problem still persists, swap the motherboard with a known good motherboard. In addition, test the suspected motherboard in another known working system.

Introduction

This document is written for professional system integrators building PCs from industry accepted motherboards, chassis, and peripherals. It provides information and recommendations for thermal management in desktop systems using boxed Intel® Pentium® III Processors, Pentium® II processors, and Celeron® processors. (The term "boxed processors" refers to processors packaged for use by system integrators.)

It is assumed that the reader has a general knowledge of and experience with desktop PC operation, integration, and thermal management. Integrators who follow the recommendations presented here can provide their customers with more reliable PCs and will see fewer customers returning with problems.

Thermal Management

Systems using boxed processors all require thermal management. The term "thermal management" refers to two major elements: a heatsink properly mounted to the processor and effective airflow through the system chassis. The ultimate goal of thermal management is to keep the processor at or below its maximum operating temperature.

Proper thermal management is achieved when heat is transferred from the processor to the system air, which is then vented out of the system. Desktop boxed processors are shipped with a high-quality fan heatsink, which can effectively transfer processor heat to the system air. It is the responsibility of the system integrator to ensure adequate system airflow.

This document makes recommendations for achieving good system airflow and provides suggestions for improving the effectiveness of a system's thermal management solution.

Fan Heatsink

Boxed processors are shipped in several processor packages:

• the Single Edge Contact Cartridge (S.E.C.C.)
• the Single Edge Contact Cartridge 2 (S.E.C.C.2)
• the Single Edge Processor Package (S.E.P.P.)
• and the Plastic Pin Grid Array (PPGA)

All boxed processors for desktop systems are shipped with a fan heatsink and fan power cable. These items should be used following the directions contained within the boxed processor installation notes included in the processor box. Thermal interface material (already applied) provides effective heat transfer from the processor to the fan heatsink. S.E.C.C., S.E.C.C.2, and S.E.P.P. boxed processors ship with an attached fan heatsink with the thermal interface material included between the processor and the fan heatsink. Current PPGA boxed processors ship with an unattached fan heatsink that includes thermal interface material on the fan heatsink base and a fan cable incorporated into the fan. The fan cable provides power to the fan by connecting to a motherboard-mounted power header. Some boxed processor fan heatsinks provide fan speed information to the motherboard. (Only motherboards with hardware monitoring circuitry can use the fan speed signal.)

Boxed processors use high-quality ball-bearing fans that provide a good local air stream. This local air stream transfers heat from the heatsink to the air inside the system. However, moving heat to the system air is only half the task. Sufficient system airflow is also needed in order to exhaust the air. Without a steady stream of air through the system, the fan heatsink will recirculate warm air, and therefore may not cool the processor adequately.

System Airflow

System airflow is determined by the following:

• Chassis design
• Chassis size
• Location of chassis air intake and exhaust vents
• Power supply fan capacity and venting
• Location of the processor slot(s)
• Placement of add-in cards and cables

System integrators must ensure airflow through the system to allow the fan heatsink to work effectively. Proper attention to airflow when selecting subassemblies and building PCs is important for good thermal management and reliable system operation.

Integrators use three basic chassis form factors for desktop systems: ATX, microATX, and the older Baby AT form factor.

In systems using Baby AT components, airflow is usually from front to back. Air enters the chassis from vents at the front and is drawn through the chassis by the power supply fan. The power supply fan exhausts the air through the back of the chassis. Figure 1 and Figure 2 show the airflow through Baby AT systems.

Figure 1. System Airflow Through Baby AT Desktop Chassis (Top View)

Figure 2. System Airflow Through Baby AT Tower Chassis (Side View)

Intel recommends the use of ATX and microATX form factor motherboards and chassis for boxed processors. The ATX and microATX form factors simplify assembly and upgrading of desktop systems, while improving the consistency of airflow to the processor.

With regard to thermal management, ATX components differ from Baby AT components in that the processor is located close to the power supply, rather than to the front panel of the chassis. Power supplies that blow air out of the chassis provide proper airflow for active fan heatsinks. The boxed processor's active fan heatsink cools the processor more effectively when combined with an exhausting power supply fan. Because of this, the airflow in systems using the boxed processor should flow from the front of the chassis, directly across the motherboard and processor, and out of the power supply exhaust vents. Figure 3 shows proper airflow through an ATX system to achieve the most effective cooling for a boxed processor with an active fan heatsink. For boxed processors, chassis that conform to the ATX Specification Revision 2.01 or later are highly recommended. For more information on the ATX form factor, and a list of ATX chassis manufacturers, please visit the ATX Web site.

Figure 3. System Airflow Through ATX Tower Chassis Optimized For the Boxed Processor With an Active Fan Heatsink

One of the ways microATX chassis differ from ATX chassis is that the power supply location and type may vary. Thermal management improvements that apply to ATX chassis will also apply to microATX. For more information on the microATX form factor, and a list of microATX chassis manufacturers, please visit the microATX* web site.

The following is a list of guidelines to be used when integrating a system. Specific mention of Baby AT, ATX, or microATX components is made where necessary.

• Chassis vents must be functional and not excessive in quantity
  Integrators should be careful not to select chassis that contain cosmetic vents only. Cosmetic vents are designed to look like they allow air into the chassis but no air (or little air) actually enters. Chassis with excessive air vents should also be avoided. For example, if a Baby AT chassis has large air vents on all sides; most air enters near the power supply and then immediately exits through the power supply or nearby vents. Very little air flows over the processor and other components. In ATX and microATX chassis, I/O shields must be present. Otherwise, the I/O opening may provide for excessive venting.
  
  
• Vents must be properly located
  Systems must have properly located intake and exhaust vents. The best location for vents will allow air to enter the chassis and flow on a path through the system that is over various components and directly over the processor. Specific location of vents depends upon the type of chassis. For most desktop Baby AT systems, the processor is located near the front, and thus intake vents on the front panel work best. For Baby AT tower systems, vents on the bottom of the front panel work best. For ATX and microATX systems, vents should be located both in the bottom front and bottom rear of the chassis. Also for ATX and microATX systems, I/O shields must be present to allow the chassis to vent air as designed. Lack of an I/O shield may disrupt proper airflow or circulation within the chassis.
  
  
• Power Supply Airflow Direction
  It is important to choose a power supply that has a fan that draws air in the proper direction. For most ATX and microATX systems, power supplies that act as an exhaust fan, drawing air out of the system, work most efficiently with active fan heatsinks. For most Baby AT systems, the power supply fan acts as an exhaust fan, venting system air outside the chassis. Some power supplies have markings noting airflow direction. Ensure the proper power supply is used based upon the system form factor.
  
  
• Power Supply Fan Strength
  PC power supplies contain a fan. Depending upon the type of power supply, the fan either draws air into or out of the chassis. If intake and exhaust vents are properly located, the power supply fan can draw enough air for most systems. For some chassis where the processor is running too warm, changing to a power supply with a stronger fan can greatly improve the airflow.
  
  
• Power Supply Venting
  Most, if not all, air flows through the power supply unit, which can be a significant restriction if not well vented. Choose a power supply unit with large vents. Wire finger guards for the power supply fan offer much less airflow resistance than openings stamped into the sheet metal casing of the power supply unit. It is important to make sure that floppy and hard drive cables not block the power supply air vents inside the chassis.
  
  
• System Fan - Should It Be Used
  Some chassis may contain a system fan (in addition to the power supply fan) to facilitate airflow. A system fan is typically used with passive heatsinks. With fan heatsinks, a system fan can have mixed results. In some situations, a system fan improves system cooling. However, sometimes a system fan recirculates warm air within the chassis, thereby reducing the thermal performance of the fan heatsink. When using processors with fan heatsinks, rather than adding a system fan, it is generally a better solution to change to a power supply with a more powerful fan. Thermal testing both with a system fan and without the fan will reveal which configuration is best for a specific chassis.
  
  
• System Fan Airflow Direction
  When using a system fan, ensure that it draws air in the same direction as the overall system airflow. For example, a system fan in a Baby AT system might act as an intake fan, pulling in additional air from the front chassis vents.
  
  
• Protect Against Hot Spots
  A system may have a strong airflow, but still contain "hot spots." Hot spots are areas within the chassis that are significantly warmer than the rest of the chassis air. Such areas can be created by improper positioning of the exhaust fan, adapter cards, cables, or chassis brackets and subassemblies blocking the airflow within the system. To avoid hot spots, place exhaust fans as needed, reposition full-length adapter cards or use half-length cards, reroute and tie cables, and ensure space is provided around and over the processor.

Thermal Testing

Differences in motherboards, power supplies, and chassis all affect the operating temperature of processors. Thermal testing is highly recommended when choosing a new supplier for motherboards or chassis, or when starting to use new products. Thermal testing can show integrators if a specific chassis-power supply-motherboard configuration provides adequate airflow for boxed processors.

Testing using the proper thermal measurement tools can validate proper thermal management or demonstrate the need for improved thermal management. Verifying the thermal solution of a reference system allows integrators to minimize test time while incorporating the increased thermal demands of possible future end-user upgrades. Testing a representative system and an "upgraded" system provides confidence that a system's thermal management will be acceptable over the lifetime of the system. Upgraded systems may have extra add-in cards, graphics solutions with higher power requirements, warmer running hard drives, etc.

Thermal testing should be done on each chassis-power supply-motherboard configuration using the components that dissipate the most power. Variations in processor speed, graphics solutions, etc. do not require additional thermal testing if testing is done with the highest power-dissipating configuration.

Summary

All desktop systems based on boxed Intel processors require thermal management. Boxed processors provide high quality fan heatsinks that provide an excellent local air stream. It is the responsibility of the integrator to ensure proper system thermal management by selecting chassis, motherboards, and power supplies that provide adequate system airflow through the system. Some specific chassis characteristics that affect system airflow include power supply fan size and strength, chassis venting, and additional system fans. Thermal testing should be done on each chassis-power supply-motherboard combination to verify the thermal management solution and ensure that the boxed processor is operating below its maximum operating temperature.

• No boot
• Fan activity
• Lights
• No monitor activity

Symptom:

Important Note: Only a computer professional should assemble, disassemble, upgrade, or troubleshoot computers since the electronic devices may cause serious damage to the installer, the system, or its components if these actions are done improperly. Before attempting to disassemble or assemble computers, install components in a computer or troubleshoot computers, carefully review the documentation specific for the computer and its related components. Lastly, make sure to follow procedures to prevent damage from Electrostatic Discharge (ESD).

• Determine if the system worked before. Determine if there have been any recent changes. Often if a recent change is been made, the recent change is the cause of the problem.
  
  
• Make sure that the monitor is plugged in and that the monitor is on.
  
  
• Make sure that the video cable is connected properly at the monitor and the PC.
  
  
• Determine if there is power light on the monitor. Most monitors will have a green light indicating it has sufficient power and is getting a video signal and an amber light if it has power but it is not getting a video signal from the computer. If you have no lights, it is most likely a problem with the monitor. Make sure that the monitor is connected to a working AC outlet, the AC power cord is plugged into the wall outlet and the monitor. If you have any on/off switches for the outlet, make sure that the switches are on. If the problem still persists, try replacing the monitor and try the monitor on another AC outlet and another system. If you have an amber light, it is most likely a problem with the computer.
  
  
• Check the brightness and contrast controls on the monitor. The monitor might be dimmed where you cannot see anything on the monitor.
  
  
• If you have a light on the monitor, use a voltmeter or an AC wall outlet tester found in a hardware store to confirm that there is adequate AC voltage at the wall outlet for the computer.
  
  
• If your AC outlet for your computer is connected to an on/off outlet switch, make sure that it is on.
  
  
• Ensure the selected motherboard is appropriate for the processor model, frequency, and stepping you are planning to use. For more information, refer to the Motherboard Selection and Voltage Requirements section of the Integration Overview document.
  
  
• Verify that your chassis/case and power supply is appropriate for the processor model and frequency and the motherboard you are planning to use.
  
  
• Verify that the power supply has the capacity to power all the devices used in your system. It is recommended to use at least a 200 W power supply, but may require a power supply with a higher capacity depending on the number of devices and the type of devices connected to your computer.
  
  
• Make sure the drive ribbon cables inside the computer are attached correctly and secure. Be sure to check the orientation of pin 1 of Hard Drive. If the ribbon cable is connected backwards may cause the computer not to power up.
  
  * Check for foreign objects such as screws that may ground the motherboard and make sure the screws that hold the motherboard are not too tight.
  
  
• Check the cables that connect from the case to the motherboard. Be sure to include the power switch (PWR SW) and power LED (PWR LED). Refer to the motherboard manual for more information.
  
  
• Use a voltmeter to verify that each output from the power supply is correct. If any output is very low (especially the +5 volt output, replace the power supply).
  
  
• Use a voltmeter to verify the PowerGood signal is +5 volts. If the signal is below 1.0 volts, there may be a short or overload causing a constant reset. Consider replacing the power supply.
  
  
• Check for shorts and overloads inside computer by removing nonessential items such as extra controller cards and IDE/ATAPI devices and turning the computer on to see if it starts to boot. Leave the motherboard, power supply, RAM or processor. If the problem goes away, there was a short or overload with one of the components that you just removed or one of those components is faulty. Replace each of those one at a time until you isolate which is causing the problem. If the problem still occurs after removing the nonessential components, the problem has to be with the motherboard, power supply, RAM or processor.
  
  
• Remove the processor and RAM and reinstall them to make sure that they are installed correctly.
  
  
• Make sure that you have mounted the motherboard correctly with the spacers/stand-offs. In addition, make sure that when you insert the screws to tighten the motherboard into place, make sure not to tighten the screws too much.
  
  
• Determine if motherboard/system has any security features, which would disable boot.
  
  
• If you are using RDRAM, make sure that all memory sockets of a channel are filled with either a memory chip or a continuity module. In addition, if the motherboard has multiple channels, make sure that you fill the first channel once and that you check to see which memory sockets go with each channel. Lastly, the RDRAM often has to be installed in pairs of the same type of memory chips. For example, you would have to install two sticks of 64 MB of RDRAM running at 800 MHz.
  
  
• If you are using SDRAM or DDR-SDRAM, some motherboards require you to populate the memory sockets starting with the first socket. Refer to your motherboard documentation for more information.
  
  
• If the problem still persists, swap the RAM with known good RAM. In addition, test the suspected RAM in another known working system.
  
  
• If the problem still persists, swap the processor with a known good processor. In addition, test the suspected processor in another known working system.
  
  
• If the problem still persists, swap the motherboard with a known good motherboard. In addition, test the suspected motherboard in another known working system.

• What are package types?

Software utility
The Intel® Processor Frequency ID Utility was developed by Intel Corporation to enable consumers with the ability to identify and in some circumstances determine if their Intel processor is operating at the rated frequency intended by Intel Corporation. Beginning with the Intel® Pentium® III Processor, the Intel Processor Frequency ID Utility has the capability to provide actual and intended frequency, or speed, information.

Web resources
The Specification Update and the Product Specifications and Comparisons tool are resources which contain information about the different steppings and versions of processors. If you need information about the voltage, thermal specifications, the processor packaging, or other information about a particular Pentium III processor, you will need to view the part numbers on your processor and compare that information with the Specification Update or the Product Specifications and Comparisons tool.

The Specification Update is a document that has more complete information, but the Product Specifications and Comparisons tool may be a bit easier to use.

The Product Specifications and Comparisons tool was designed as a reference to help you look up technical spec information on your Intel® Processor. To find the information that you are looking for, you will need to know your processor's sSpec number.

Package markings: flip-chip pin grid array (FC-PGA)/FC-PGA2
These markings are located on the top side of the package. On one edge, the copyright, country of origin, speed of the processor, cache size, bus speed of the processor and voltage. On the opposite edge are the FPO serialization number, production specification (sSpec) number and the branding of the processor. Refer to the Specification Update for more detailed information. The FC-PGA2 packages are similar to the FC-PGA package except the FC-PGA2 use an Integrated Heat Spreader (IHS) that covers the die.

Package markings: single edge contact cartridge (S.E.C.C.) and single edge contact cartridge 2(S.E.C.C.2)
The Intel Pentium III Processor's S.E.C.C. and S.E.C.C.2 cartridges have laser etched markings that indicate the processor's core speed, L2 cache size, S-spec number, serialization code, and country of origin. The markings are located on top of the cartridge. Refer to the Specification Update for more details.

• Pentium III Processor-based system
• Windows* 95, Windows* 98, Windows NT* 4.0
• 2 megabytes of hard disk space

• Applications using security capabilities
• Manageability
• Information Management

This document describes the various desktop processor package types.

FC-LGAx package type
The FC-LGAx package is the latest package type used with the current family of desktop processors going back to the Intel® Pentium® 4 processors designed for the LGA775 socket and extending to the Intel® Core™i7-2xxx series processors designed for the LGA1155 socket. FC-LGA is short for Flip Chip Land Grid Array x. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number x stands for the revision number of the package.

This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink. You may also see references to processors in the 775-LAND or LAG775 package. This refers to the number of contacts that the package contains that interface with the LGA775 socket.

Current socket types that are used with the FC-LGAx Package types are LGA775, LGA1366 and LGA1156. Sockets are not interchangeable and must be matched to motherboards for compatibility. (Motherboard BIOS support for processors is also required for compatibility.)

LGA775 socket (2004)

The pictures below may include the LAND Side Cover (LSC). This black cover is no longer being used.

Photo examples
(Front side) (Back side)

LGA1366 socket (2008)

Photo examples
(Front side) (Back side)

LGA1156 socket (2009)

Photo examples
(Front side) (Back side)

LGA1155 socket (2011)

Photo examples
(Front side) (Back side)

LGA1150 socket (2013)

Photo examples
(Front side) (Back side)

FC-PGA2 package type
FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).

Pentium 4 processor
Photo examples
(Front side) (Back side)

Pentium III and Intel® Celeron® Processor
Photo examples
(Front side) (Back side)

FC-PGA package type
The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.

Photo examples
(Front side) (Back side)

OOI package type
OOI is short for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate facedown for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins.

Photo examples
(Front side) (Back side)

PGA package type
PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon® processor, which has 603 pins.

Photo examples
(Front side) (Back side)

PPGA package type
PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.

Photo examples
(Front side) (Back side)

S.E.C.C. package type
S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses gold finger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon® and Pentium III Xeon processors, which have 330 contacts.

Photo examples
(Front side) (Back side)

S.E.C.C.2 package type
The S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts).

Photo examples
(Front side) (Back side)

S.E.P. package type
S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to an S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 242 contacts.

Photo examples
(Front side) (Back side)

The Intel® Pentium® III processor integrates the P6 Dynamic Execution microarchitecture, Dual Independent Bus (DIB) Architecture, a multi-transaction system bus and Intel® MMX™ media enhancement technology. In addition, the Intel® Pentium® III processor offers Internet Streaming SIMD Extensions, 70 instructions enabling advanced imaging, 3D streaming audio and video, and speech recognition for an enhanced Internet experience. Versions also include an Advanced Transfer Cache and Advanced System Buffering to meet the higher data bandwidth requirements of today's environments. With great performance for the Internet, the connected home, and multitasking environments, Intel® Pentium® III Processors are targeted at the range of mainstream consumer and business users. The Intel® Pentium® III Processor also meets the needs of entry-level workstations and servers.

Product highlights

• The Intel® Pentium® III Processor is available at speeds ranging from 450 MHz to 1.33 GHz
• Versions available with either a 133 MHz or a 100 MHz system bus
• Versions that incorporate 256KB Advanced Transfer Cache (on-die, full-speed level 2 (L2) cache with Error Correcting Code (ECC) or versions that incorporate a discrete, half-speed, 256KB in package L2 cache with ECC
• Versions that incorporate Data Prefetch Logic (DPL), which anticipates the data needed by the application and pre-loads it into the Advance Transfer Cache, designed to further increase the processor and application performance
• 32KB (16KB/16KB) non-blocking, level 1 (L1) cache
• P6 Dynamic Execution microarchitecture including multiple branch prediction, data flow analysis and speculative execution
• Internet Streaming SIMD Extensions, consisting of 70 instructions that enable advanced imaging, 3D streaming audio and video, speech recognition and an enhanced Internet experience
• Intel® MMX™ media enhancement technology
• Dual Independent Bus (DIB) architecture increases bandwidth and performance over single-bus processors
• Memory cacheability up to 4GB of addressable memory space and system memory scalability up to 64GB of physical memory
• Both dual-processor capable and uni-processor only versions
• Data integrity and reliability features such as Error Correction Code, Fault Analysis and Recovery for both system and L2 cache buses
• Versions based upon Intel’s 0.13, 0.18 and 0.25 micron manufacturing processes for increased processor core frequencies and reduced power consumption
• Fully compatible with existing Intel Architecture-based software

Product performance

The Intel® Pentium® III Processor family delivers great performance. For the spectrum of Intel® Pentium® III Processor performance, please compare desktop processor specifications.

Intel Pentium® III Processor for desktop PCs and entry-level workstations and servers

The Intel® Pentium® III Processor family now includes versions up to 1.33 GHz for desktop PCs, as well as entry-level workstations and servers. All are binary compatible with previous generation Intel Architecture processors. Figure 1 summarizes the features of each currently available version.

Intel® Pentium® III 256KB Processor features

Processor Package Options
Intel® Pentium® III Processors are now available in three different package options: Single Edge Contact Cartridge 2 (S.E.C.C.2), Flip-Chip Pin Grid Array (FC-PGA) and Flip-Chip Pin Grid Array 2 (FC-PGA2). The FC-PGA and FC-PGA2 packages are designed for the new breed of sleek, powerful, small form factor PCs. See Figure 1 for versions available in each package type.
P6 Dynamic Execution Microarchitecture
	Multiple branch prediction: predicts program execution through multiple branches, accelerating the flow of work to the processor.
	Dataflow analysis: Creates an optimized, reordered schedule of instructions by analyzing data dependencies between instructions.
	Speculative execution: carries out instruction execution speculatively and based upon this optimized schedule, ensures that the processor’s superscalar execution units remain busy, boosting overall performance.
Dual Independent Bus (DIB)
The Intel® Pentium® III Processor supports the high-performance Dual Independent Bus (DIB) architecture. The DIB architecture places the level 2 cache on a dedicated, high speed cache bus allowing for the system bus to be freed up from cache traffic. This provides significantly higher overall system bandwidth and allows for a dramatic improvement in system performance and scalability.
Non-Blocking Level 1 Cache
The Intel® Pentium® III Processor includes two separate 16KB level 1 (L1) caches, one for instruction and one for data. The L1 cache provides fast access to the recently used data, increasing the overall performance of the system.
256KB Level 2 Advanced Transfer Cache
(Available on certain versions as specified in Figure 1) The Advanced Transfer Cache (ATC) consists of microarchitectural improvements to provide a higher data bandwidth interface between the level 2 cache and the processor core that is completely scalable with the processor core frequency. Features of the ATC include:
	Non-Blocking, full speed, on-die level 2 cache
	8-way set associativity
	256-bit data bus to the level 2 cache
	Reduced latency interface to cache data (as compared to discrete caches)
Non-Blocking Level 2 Cache
(Available on certain versions as specified in Figure 1) Certain versions of the Intel® Pentium® III Processor include a Discrete, off-die level 2 (L2) cache. This L2 cache consists of a 256KB unified, non-blocking cache that improves performance over cache-on-motherboard solutions by reducing the average memory access time and by providing fast access to recently used instructions and data. Performance is also enhanced over cache-on-motherboard implementations through a dedicated 64-bit cache bus.
Advanced System Buffering
(Available on certain versions as specified in Figure 1) The Advanced System Buffering consists of optimizations in the system bus buffer sizes and bus queue entries that result in an increase in the utilization of the available bandwidth on the 100 and 133 MHz system bus.
	4 writeback buffers
	6 fill buffers
	8 bus queue entries
Internet Streaming SIMD Extensions
The Internet Streaming SIMD Extensions consist of 70 instructions and includes single instruction, multiple data for floating-point, additional SIMD-integer and cacheability control instructions. Some of the benefits to desktop and Internet applications of Internet Streaming SIMD Extensions include:
	Higher resolution and quality images can be viewed and manipulated than previously possible
	High quality audio, MPEG2 video, and simultaneous MPEG2 encoding and decoding
	Reduced CPU utilization for speech recognition, as well as higher accuracy and faster response times
Up to 133 MHz System Bus
	The system bus runs at 100 MHz or 133 MHz (available on certain versions outlined in Figure 1) allowing for a 33% increase in available bandwidth to the processor (over 100 MHz system bus)
	The system bus supports multiple outstanding transactions to increase bandwidth availability. It also provides “glueless” support for up to two processors (S.E.C.C.2 package only). This enables low-cost, two-way symmetric multiprocessing, providing a significant performance boost for multi-tasking operating systems and multi-threaded applications.
Other significant features of the Intel® Pentium® III Processor
	A pipelined Floating-Point Unit (FPU) for supporting the 32-bit and 64-bit formats specified in IEEE standard 754, as well as an 80-bit format.
	Parity-protected address/request and response system bus signals with a retry mechanism for high data integrity and reliability.
Features Used for Testing and Performance Monitoring
	Built-in Self Test (BIST) provides single stuck-at fault coverage of the microcode and large logic arrays, as well as testing of the instruction cache, data cache, Translation Lookaside Buffers (TLBs), and ROMs.
	IEEE 1149.1 Standard Test Access Port and Boundary Scan mechanism enables testing of the Pentium III processor and system connections through a standard interface.
	Internal performance counters for performance monitoring and event counting.
	Incorporates an on-die diode that can be used to monitor the die temperature. A thermal sensor located on the motherboard can monitor the die temperature of the Pentium III processor for thermal management purposes.
The Intel® Pentium® III Processor may contain design defects or errors known as errata. Current characterized errata are available upon request. Internet applications are evolving at a tremendous rate and include browser, 3D, and multimedia technologies. In attempting to evaluate processor Internet performance, PC users should consult the productivity, 3D, and multimedia benchmarks. Additionally, Java Internet technology benchmarks can be used to measure Java aspects of the Internet experience. Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, reference: http://www.intel.com/products/benchmarks/desktop/index.htm or call (U.S.) 1-800-628-8686 or 1-916-356-3104. Information in this document is provided in connection with Intel products. No license, express or implied, by Intel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. The Intel® Pentium® III Xeon® Processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Such errata are not covered by Intel’s warranty. Current characterized errata are available on request.

The Boxed Intel® Pentium® III Processor

General information

Performance
The Intel® Pentium® III Processor offers top performance for today and tomorrow's applications as well as quality, reliability, and compatibility from the world's leading microprocessor company. Users can expect excellent PC software performance and full compatibility with Intel Architecture-based software. Processing power is extended to allow for higher performance of business media, communication, and Internet capabilities. Web sites designed with the Intel Pentium III Processor in mind will unleash the full multimedia capabilities of the processor, which leads to an enhanced, exciting Internet experience.

Technology
The Intel Pentium III Processor integrates the best attributes of the P6 microarchitecture processors: Dynamic Execution, a multi-transaction system bus, and Intel MMX™ media enhancement technology. For an enhanced Internet experience, the Intel Pentium III Processor offers Internet Streaming SIMD Extensions, 70 new instructions enabling advanced imaging, streaming audio and video, speech recognition, and 3-D. The Intel Pentium III Processor also incorporates the processor serial number. The 96-bit serial number is accessible through the CPUID instruction and can be used by software applications to identify a system. Note: This feature can be legally disabled at the BIOS level. See the Loading a Processor Serial Number Control Utility section for more details.

The Intel Pentium III Processor also incorporates Dual Independent Bus architecture. Two buses make up the Dual Independent Bus architecture: (1) L2 cache bus and (2) processor-to-main-memory system bus. The Intel Pentium III Processor can use both buses simultaneously, achieving more than two times the data in or out of the Intel Pentium III Processor than a single bus architecture processor. The system bus provides increased bandwidth for today's newer, demanding technologies, such as the Accelerated Graphics Port (AGP). The Dual Independent Bus architecture enables the closely coupled L2 cache of the Intel Pentium III Processor to run more than four times as fast as the L2 cache on Pentium processor-based systems. Finally, the pipelined system bus enables multiple simultaneous transactions (instead of singular sequential transactions), accelerating the flow of information within the system and boosting overall performance. All Intel Pentium III Processors use the Error Checking and Correction (ECC) protocol on the L2 cache bus. Since ECC protocol is a more comprehensive method of ensuring data integrity, it can detect both single-bit and double-bit errors and correct single-bit errors automatically.

Platform initiatives
The latest addition to the IA-32 processor line is the Intel Pentium III Processor manufactured on 0.13 micron technology. This manufacturing process technology is coupled with an on-die full-speed advanced transfer L2 cache and enables a new form factor. Boxed Intel Pentium III Processors are now available in two package options: (1) Single Edge Contact Cartridge 2 (S.E.C.C.2) and (2) Flip Chip Pin Grid Array (FC-PGA) package, and (3) Flip Chip Pin Grid Array2 (FC-PGA2) Package. The FC-PGA package is designed for the new breed of sleek, high performance, small form factor PCs. The FC-PGA2 package is an FCPGA package with the addition of an integrated heat spreader (IHS). The HIS provides improved package thermal cooling characteristics for higher speed Intel® Pentium® III Processors without having to use a larger heat sink.

Table 1. Boxed Intel® Pentium® III Processor Product Feature Summary

Integrating Boxed Intel® Pentium® III Processor-Based systems

Motherboard selection

Overview
Motherboards used with the boxed Intel Pentium III Processor must specifically support the processor type and core speed. Some older motherboards may not support all speeds of the boxed Intel Pentium III Processor. Using a boxed Intel Pentium III Processor in a motherboard that does not support its current electrical requirements can cause permanent damage to the motherboard. Some older motherboards will require BIOS upgrades in order to properly recognize and setup the Intel Pentium III Processor. Using a Intel Pentium III Processor with the incorrect BIOS revision may cause a system to be unstable. Verify that the specific motherboard and BIOS revision will support the Intel® Pentium® III Processor. Motherboards used with Intel Pentium III Processors must meet Intel's published processor specifications.

To ensure compatibility, Intel offers boxed boards for system integrators in ATX and microATX form-factor designs for use with the boxed Intel Pentium III Processor.

Fan heat sink requirements
The boxed Intel Pentium III Processor is delivered with a fan heat sink specially designed to provide efficient cooling in a variety of thermal environments. The fan power cable must be connected to the fan power connector and the motherboard power header as shown in the processor installation notes (included in the boxed processor package).

The motherboard 3-pin power header uses two pins to supply +12V and GND. The fan uses the third pin to transmit fan-speed information to motherboards that support fan-speed detection. Your motherboard must have a 3-pin fan power header located close to the slot or socket. Refer to your motherboard manual for the location of the power header.

Voltage requirements
Intel Pentium III Processors are specified to operate at the voltages listed in Table 2.

Proper voltage must be supplied for reliable operation. Voltage may be supplied by a regulator integrated on the motherboard, or by a voltage regulator module (VRM) installed in Header 8 on the motherboard.

If the regulator is integrated on the motherboard, it must be Voltage ID (VID) programmable to allow the processor to program the correct voltage during power-on. If the motherboard has Header 8, then a VRM must be installed in the header to power the processor. Most VRMs are VID-programmable. If your motherboard has a fixed-voltage VRM, its output voltage must match the processor requirements.

Since the operating voltage of Intel Pentium III Processors may change as the processor goes through stepping changes, VID-programmable voltage regulators are the preferred solution. For complete voltage specifications for Intel Pentium III Processors, refer to the Intel® Pentium® III Processor Data sheet.

Chassis selection
Intel encourages integrators using ATX form-factor boards. Choose a chassis that complies with the ATX specification (version 2.01 or later). A copy of the most current ATX specification appears on the Form Factor Web site. The site also lists ATX chassis manufacturers.

Integrators using microATX form-factor motherboards should choose a chassis that complies with the microATX specification (version 1.0). A copy of the most current microATX specification appears on the Form Factor Web site. The site also lists microATX chassis manufacturers.

In addition, Intel tests chassis for compatibility with boxed Intel Pentium III Processors and Intel Desktop Boards for system integrators.

Thermal Management Considerations

Thermal testing should always be performed when selecting a chassis for boxed Intel Pentium III Processor-based systems.

You must use a chassis that provides sufficient airflow to keep the processor under its maximum operating temperature in the warmest user environment. Running the processor above its maximum temperature specification will void the warranty and can lead to functional and performance degradation.

Intel recommends the use of ATX 2.01 or later or microATX 1.0-compliant motherboards and chassis for proper mechanical fit. The combination of the fan heat sink shipped with the boxed Intel Pentium III Processor, an ATX or microATX form-factor motherboard, and an ATX or microATX-compliant chassis can be a good thermal management solution.

If you use Baby AT motherboards, be aware that the airflow varies significantly in different Baby AT chassis, depending on venting, internal brackets, and other factors. Chassis with low airflow can cause processors to exceed their maximum thermal specification.

Intel's tested chassis lists contain the names of chassis that have been tested by Intel. Listed chassis provide adequate airflow and ventilation to cool boxed Intel® Pentium® III Processors when installed in typically configured systems on Intel Desktop Boards. However, additional thermal testing is necessary for each system configuration, even when using a chassis on the tested chassis list.

Boxed Intel Pentium III Processor installation instructions

S.E.C.C.2 package

Motherboard Mechanical Requirements

Motherboards supporting the boxed Intel Pentium III Processor feature a single-edge slot connector called the 242-contact slot connector. The boxed Intel Pentium III Processor in the S.E.C.C.2 package is inserted into this connector.

The boxed Intel Pentium III Processor requires mechanical support called retention mechanisms. Retention mechanisms hold the processor securely in the 242-contact slot connector, and protect it and the motherboard from damage. Retention mechanisms are not included with the boxed Intel Pentium III Processor. The motherboard supplier should provide retention mechanisms and installation instructions. (All Intel Desktop Boards that support the 242-contact slot connector include retention mechanisms.)

Some older motherboards may be shipped with retention mechanisms that only support the S.E.C.C. package and do not support processors in the S.E.C.C.2 package. Using a boxed Intel Pentium III Processor in the wrong retention mechanism will void the warranty. Contact the motherboard manufacturer to determine the processor support of the retention mechanisms provided with the motherboard.

Figure 1. Boxed Intel® Pentium® III Processor
in the S.E.C.C.2 Package
(fan power cable not shown)

Intel Pentium III Processor installation and removal instructions

Installation and removal may vary slightly based on the retention mechanisms provided by the motherboard manufacturer. These guidelines assume the use of universal retention mechanisms. Installation into other types of retention mechanisms is similar. Motherboards shipped with retention mechanisms should have instructions on inserting the processor into the 242-contact slot connector.

Intel Pentium III Processor installation steps:

1. Install the retention mechanism(s) onto the motherboard using the motherboard manufacturer's instructions.
2. Install the processor into the 242-contact slot connector by applying force to the top of the processor and fan heat sink. Make sure to install the heat sink into the retention mechanism and the processor substrate into the 242-contact slot connector. Do not bend the processor package.
3. Install the processor fan cable to the motherboard connector and the fan heat sink.
4. Power on the system and verify that the processor fan is running.
5. Shut down system.

Figure 2. Boxed Intel® Pentium® III Processor
Removal Diagram

Intel Pentium III Processor removal steps: Refer to Figure 2, boxed Intel Pentium III Processor removal diagram. First pull one retention mechanism away from the processor with one hand while rotating the processor out of the 242-contact slot connector with the other hand. The retention mechanisms provide firm mechanical support for the processor.

Removing retention mechanisms with plastic fasteners requires the removal of the motherboard from the chassis.

1. After the motherboard is removed and while viewing the underside of the motherboard, use the tip of a ballpoint pen or other tool to carefully push the bottom of the white pin insert out of the black plastic fastener sleeve.
2. After the white insert pins are removed, carefully push the black sleeve portion of the fastener out of the motherboard to free the retention mechanism.

FC-PGA2 package
The FC-PGA2 package is an FCPGA package with the addition of an integrated heat spreader (IHS). The IHS provides improved package thermal cooling characteristics for higher speed Intel® Pentium® III Processors without having to use a larger heat sink. Besides those differences, the installation requirements are similar to the FC-PGA Package.

FC-PGA package

Motherboard Mechanical Requirements

Motherboards supporting the boxed Intel Pentium III Processor in the FC-PGA package feature a socket called the 370-pin socket. The boxed Intel Pentium III Processor is inserted into this socket.

Figure 3a: Boxed Intel® Pentium® III Processor in the FC-PGA Package to 933 MHz Figure 3b: Boxed Intel® Pentium® III Processor in the FC-PGA Package at 1 GHz or greater

Intel recommends motherboards equipped with the PGA370 socket for the boxed Intel Pentium III Processor in the FC-PGA package. The motherboard must be specifically for the Intel Pentium III Processors. However, if it is necessary to use a "slot-to-socket adapter (SSA)", follow these critical considerations and recommendations:

1. The SSA must be recommended by the motherboard manufacturer for use with the boxed Intel Pentium III Processor and your selected motherboard.
2. The SSA must operate the processor within Intel's electrical, mechanical, and thermal specifications.
3. Intel does not validate SSAs for use with Intel branded boards or third-party motherboards.

Integrating the boxed Intel Pentium III Processor in the FC-PGA package into SSAs that are designed for the Intel Celeron processor may damage the Intel Pentium III Processor. For specific validation of any SSA with your motherboard and processor, please check with your motherboard vendor.

Be aware of thermal considerations and mechanical requirements when installing any SSA. The fan heat sink included in the boxed processor package will provide sufficient cooling. However, this solution violates the maximum mechanical volumetric dimensions and weight restrictions that are recommended for motherboards with the 242-contact slot connector. Violating this recommendation will result in the SSA "leaning" to one side, which may cause broken electrical connections and interference with motherboard components. Therefore, system integrators using an SSA must follow two requirements when installing a boxed Intel Pentium III Processor.

1. The SSA is electrically connected and mechanically held secure in the 242-contact slot connector (consider a SSA with a retention mechanism interface).
2. No motherboard components are adversely affected by installing the boxed processor on the SSA.

Figure 4. Slot-to-Socket Adapter (SSA)
Installed into a Motherboard

How to install and remove the fan heat sink of the boxed Intel® Pentium® III Processor

For a detailed description on installing the boxed Intel® Pentium® III Processor, refer to the installation manual.

Intel® Pentium® III Processor with Metal Heat sink Clip
Intel® Pentium® III Processor with Plastic Heat sink Clip

Intel Pentium III Processor installation steps for metal heat sink clip:

1. Raise the handle of the 370-pin socket.
2. Carefully install the processor into the 370-pin socket making sure that none of the pins are bent.
3. Close the handle of the socket.
4. Next install the fan heat sink. Make sure to install the heat sink onto the processor after the processor has been inserted into the 370-pin socket. Place the fan heat sink onto the processor so that the integrated clip lines up with the socket's attach tabs and the fan cable aligns with the PGA370 mark on the 370-pin socket.
   

   Caution Take care to not damage the white thermal interface pad on the bottom of the heat sink.

5. Locate the socket tab opposite the PGA370 mark on the socket. Latch the clip to this tab first.
6. To attach the clip to the other socket tab, locate a standard #1, small flathead screwdriver and align with upper clip slot (Figure 5a - 'B').
   
7. Insert screwdriver into clip slot. Extend (as shown in Figure 5a - 'D') the heat sink clip away from the socket tab (Figure 5a - 'C') by rotating the screwdriver upwards toward the fan heat sink (Figure 5a - 'A').
   
8. Continue rotating the screwdriver upwards (as shown in Figure 5b - 'A') until the bottom edge of the clip clears the socket tab (Figure 5b - 'D').
   
9. Slowly push down on the clip (as shown in Figure 5b - 'B') until it is lined up with the bottom edge of the socket (Figure 5b - 'C').
   
10. Latch clip onto socket tab (Figure 5b - 'D').
    

    Caution Take care to not scrape the motherboard underneath the 370-pin socket attach tabs.

11. Connect the integrated fan power cable to the motherboard connector.
12. Power on the system just long enough to verify that the processor fan operates.

Figure 5a: Step 1 of Boxed Intel® Pentium® III Processor FC-PGA Install Figure 5b: Step 2 of Boxed Intel® Pentium® III Processor FC-PGA Install

Before removing the processor, consider removing the motherboard from the chassis.

Intel® Pentium® III Processor removal steps for metal heat sink clip:

1. Unplug the fan power cable from the motherboard's connector.
2. Follow installation steps 5-10 in reverse order.
3. Use a #1, small flathead screwdriver to unlatch the integrated clip from the socket's tab nearest the fan cable.
4. Insert screwdriver into upper clip slot. Push down on the clip and simultaneously rotate the screwdriver towards the fan heat sink (see Figure 5b).
5. After the heat sink clip is free, slowly lift the fan heat sink straight up and away from the socket and the processor.
6. Raise the handle of the 370-pin socket, and then carefully remove the processor from the socket.
   

   Caution Make sure to not bend any of the processor pins.

Intel® Pentium® III Processor installation instructions for the plastic heat sink clip:

1. Raise the handle of the 370-pin socket.
2. Carefully install the processor into the 370-pin socket making sure that none of the pins are bent.
3. Close the handle of the socket (A). See Fig. 6a.
4. Align the fan heat sink clip to the socket as shown in Fig. 6a. Make sure to align the pin on the heat sink clip (B) to the hole in the fan heat sink.
5. Align the pin hole (C) with the PGA370 mark (D) on the socket. With the clip lever in the up position, install the fan heat sink on the processor.
6. Make sure both sides of the clip (E) are securely fastened to the socket tabs (F). Close the clip lever.
   

   Note Be careful not the damage the thermal interface material when installing the heat sink onto the processor.

7. Snap the fan on the heat sink as shown in Figure 6b.
8. Connect the integrated fan power cable to the motherboard connector (G).
9. Power on the system just long enough to verify that the processor fan operates.

Figure 6b : Step 2 of the Installation of the Boxed FC-PGA Intel® Pentium® III Processor at 1 GHz Figure 6c: Removal of the Boxed FC-PGA Intel® Pentium® III Processor at 1 GHz

IMPORTANT NOTE: If the fan is attached incorrectly, it may unlatch itself at a later time from normal jarring of the computer. If the fan detaches from the heat sink, the processor may be permanently damaged.

Please refer to figure 7a and 7b for the proper fan orientation. Notice the position of the Intel hologram and fan cable relative to the heat sink clip. Figure 1 is the incorrect fan orientation and figure 2 is the proper fan orientation. Furthermore, please make sure the fan is securely fastened to the heat sink by firmly pulling on the fan.

Figure 7(a) shows the incorrect orientation of the heat sink fan, while Figure 7(b) shows the correct orientation of heat sink and fan.

Before removing the processor, consider removing the motherboard from the chassis.

Intel® Pentium® III Processor removal steps for plastic fan heat sink clip:

Intel Pentium III Processor removal steps:

1. Unplug the fan power cable from the motherboard's connector.
   
2. Remove the fan from the heat sink.
   
3. Open the heat sink clip lever.
   
4. Referring to Figure 6c, while holding onto the heat sink, slide (H) the heat sink (J) towards the socket tab (K) located on the cam lever side (L) of the PGA370 socket. The heat sink clip should pop free of the socket tab (K).
   
5. After the heat sink clip is free, slowly lift the fan heat sink straight up and away from the socket and the processor.
   
6. Raise the handle of the 370-pin socket, and then carefully remove the processor from the socket.
   

   Caution Make sure to not bend any of the processor pins.

Operating system and application support
The Intel Pentium III Processor is backward compatible with Intel Architecture compatible operating systems and applications. Many of the new Internet Streaming SIMD Extensions can be used by applications on any operating system provided the operating supports the instructions being used. Many modern operating systems have support for all instructions introduced with the Internet Streaming SIMD Extensions, but this support may require installation of specific drivers.

Applications that do not use the Internet Streaming SIMD Extensions will still benefit from the Intel Pentium III Processor's high-speed execution and P6 microarchitecture. Applications that use the Internet Streaming SIMD Extensions should verify proper operating system support for the extensions and may signal the installer if the operating system does not yet have the proper driver support.

Integrators building systems based on the Intel Pentium III Processor should choose an operating system that supports the Internet Streaming SIMD Extensions, install any necessary drivers, and verify the operating system is prepared for applications that are optimized with the Internet Streaming SIMD Extensions.

Loading a processor serial number control utility
Computer system users should have control over which software or Web sites have permission to read the processor serial number from their system. This control can be provided by enabling or disabling the processor serial number in the BIOS through a setup option or in the operating system environment via a control utility. If either of these methods is set to "disabled," the processor serial number will not be available to software applications. The Intel processor serial number control utility is a program that enables or disables the reading of the processor serial number of the Intel Pentium III Processor in the Windows* 95, Windows 98 or Windows NT* operating system environments. Intel encourages system integrators to load a processor serial number control utility onto every Intel Pentium III Processor-based system built.

Dual processor system considerations
Intel Pentium III Processors are tested during manufacturing to ensure they will work in dual-processor configurations with processors of the same speed. Operation with different speed processors is not prohibited, but is not tested by Intel. Intel tests dual processor configurations with different steppings of the Intel Pentium III Processor as new processor steppings are introduced. For more information, see Mixing Processor Steppings below. Intel still recommends using processors of the same stepping when integrating dual processor systems.

Recommendations for integration of dual processor systems

1. Ship dual-processor systems with both processors installed to ensure that processor speeds and steppings are the same. When partially populated systems are shipped, a customer returning for additional processors may have difficulty locating a processor with the same stepping. If this occurs, the customer may have to replace the original processor to obtain a system with two processors of the same stepping.
2. If a system is shipped with only one processor installed, first test the system with both processors installed. This will demonstrate whether the motherboard will support dual-processor operation. Provide customers with the speed and stepping information of the original processor in these systems and make sure they understand the importance of having processors of the same speed and stepping. Warn customers of the risk of having to replace the original processor in the future if earlier stepping processors are not available.
3. If a system is shipped with only one processor, install the operating system with two processors installed. Some operating systems will install different kernel versions, depending on the number of processors present. The second processor can then be removed before system shipment. This technique alleviates the need to reinstall the operating system if a second processor is added later.
4. Integrators that want to mix processor steppings within a dual-processor system should first read Mixing Processor Steppings below for an overview of the issues involved.

Matching processor steppings
The easiest way to match steppings is to compare the 5-character test specification numbers on the top of Intel® Pentium® III Processors. The number starts with an "S" and is followed by 4 characters (for example, "SL3CC"). Boxed Intel Pentium III Processors have the test specification number also printed on the box label.

Identical silicon steppings may sometimes be shipped with different test specification numbers, depending on whether they are for OEMs or for system integrators. Some Intel boxed processors may have OEM test specification numbers.

Mixing processor steppings
Even though Intel recommends using identical processor steppings in multiprocessor systems whenever possible (as this is the only configuration which receives Intel's full testing), Intel supports mixing processor steppings, and does not actively prevent various steppings of the Intel Pentium III Processor from working together in dual-processor systems. However, since Intel cannot test every possible combination of devices, each new stepping of a device is fully tested only against the latest steppings of other processors and chipset components.

With mixed stepping configurations, all processors must be run at an identical frequency. The workaround for various errata must take all processors into account. Errata for the Intel Pentium III Processor are published in the Intel® Pentium® III Processor Specification Update. Errata for all processor steppings present in a system will affect that system, unless worked around.

Due to the variety of motherboard vendors in the market and the number of system BIOS revisions, some system-level issues may occur that lie outside the realm of any mixed stepping evaluation performed by Intel. Recommendations for shipping systems that mix Intel Pentium III Processor steppings are as follows:

1. Choose a motherboard vendor with a history of dual-processor experience.
2. Contact your motherboard vendor for information on mixed stepping validation performed on your particular dual processor motherboard.

Refer to the Intel® Pentium® III Processor Specification Update for information on processor errata, their workarounds, and potential performance issues before integrating dual processor systems. The specification update can be obtained from Intel's Developer Site.

Thermal management
The term "thermal management" refers to two major elements: a heatsink properly mounted to the processor, and effective airflow through the system chassis. The ultimate goal of thermal management is to keep the processor at or below its maximum operating temperature.

Proper thermal management is achieved when heat is transferred from the processor to the system air, which is then vented out of the system. Boxed Pentium III processors are shipped with an attached high-quality fan heatsink, which can effectively transfer processor heat to the system air. It is the responsibility of the system integrator to ensure adequate system airflow.

Fan heatsink
The fan heatsink that ships with the boxed Pentium III processor has already been securely attached to the processor. Thermal interface material (already applied) provides effective heat transfer from the processor to the fan heatsink. The fan cable provides power to the fan by connecting to a motherboard-mounted power header and also allows the fan to provide fan speed information to the motherboard. (Only motherboards with hardware monitoring circuitry can use the fan speed signal.)

The fan is a high-quality ball bearing fan that provides a good local air stream. This local air stream transfers heat from the heatsink to the air inside the system. However, moving heat to the system air is only half the task. Sufficient system airflow is also needed in order to exhaust the air. Without a steady stream of air through the system, the fan heatsink will re-circulate warm air that may not cool the processor adequately.

Chassis recommendations
Intel recommends the use of ATX and microATX form factor motherboards and chassis for the boxed Pentium III processor. The ATX and microATX form factors simplify assembly and upgrading of PCs, while improving the consistency of airflow to the processor. For more information, see System Thermal Management for Boxed Intel Processor-Based Desktop PCs.

Pentium III Processor thermal recommendations
Table 1 also shows the power dissipation for boxed Pentium III processors. Processors that dissipate more power will also generate more heat. Use the thermal test methodology described in Thermal Testing with Thermocouples and Thermal Meters on Intel Boxed Processor-Based Desktop PCs to test thermal management of boxed Pentium III processor-based systems. When building 242-contact slot connector systems that will feature boxed Pentium III processors, testing should be performed using the 600-MHz or a 600B-MHz processor because it dissipates the most power. When building 370-pin socket systems that will feature boxed Pentium III processors, testing should be performed using the 550E-MHz processor because it dissipates the most power.

To determine the temperature of the processor core per the specification, use the thermal methodology described in AP-905 Pentium III Processor Thermal Design Guidelines (order #245087). The process this document describes involves purchasing an evaluation kit and using the processor's thermal diode.

Table 1. Pentium® III Processor Thermal Specifications ¹

Processor Frequency Form Factor Temperatures Total Max Processor Power Max Core (TJ) Max Plate (TCASE) Fan Inlet (TA)3 Heatsink Base (THS)5 1.40 GHz- S 7 FC-PGA2 N/A 69°C 45°C N/A 5 31.2 W 1.26 GHz- S 7 FC-PGA2 N/A 69°C 45°C N/A 5 29.5 W 1.20 GHz 7 FC-PGA2 N/A 69°C 45°C N/A 5 29.9 W 1.13 GHz-S 7 FC-PGA2 N/A 69°C 45°C N/A 5 27.9 W 1.13 GHz 7 FC-PGA2 N/A 69°C 45°C N/A 5 29.1 W 1 GHz FC-PGA2 N/A N/A 45°C N/A 5 29.0 W 1 GHz FC-PGA 70°C 2 N/A 45°C N/A 5 30.0 W 1 GHz FC-PGA 70°C 2 N/A 45°C N/A 5 26.1 W 9335 MHz FC-PGA 77°C 2 N/A 45°C N/A 5 28.3 W 933 MHz S.E.C.C.2 75°C 2 N/A 45°C N/A 5 25.5 W 933 MHz FC-PGA 75°C 2 N/A 45°C N/A 5 24.5 W 900 MHz FC-PGA 75°C 2 N/A 45°C N/A 5 23.2 W 8665 MHz FC-PGA 80°C 2 N/A 45°C N/A 5 27.1 W 866 MHz S.E.C.C.2 80°C 2 N/A 45°C N/A 5 22.9 W 866 MHz FC-PGA 80°C 2 N/A 45°C N/A 5 22.9 W 850 MHz S.E.C.C.2 80°C 2 N/A 45°C N/A 5 22.5 W 850 MHz FC-PGA 80°C 2 N/A 45°C N/A 5 22.5 W 800EB MHz S.E.C.C.2 80°C 2 N/A 45°C N/A 5 20.8 W 800EB MHz FC-PGA 80°C 2 N/A 45°C N/A 5 20.8 W 800 MHz S.E.C.C.2 80°C 2 N/A 45°C N/A 5 20.8 W 800 MHz FC-PGA 80°C 2 N/A 45°C N/A 5 20.8 W 750 MHz S.E.C.C.2 80°C 2 N/A 45°C N/A 5 19.5 W 750 MHz FC-PGA 80°C 2 N/A 45°C N/A 5 19.5 W 733 MHz S.E.C.C.2 80°C 2 N/A 47°C N/A 5 19.1 W 733 MHz FC-PGA 80°C 2 N/A 47°C N/A 5 19.1 W 700 MHz S.E.C.C.2 80°C 2 N/A 47°C N/A 5 18.3 W 700 MHz FC-PGA 80°C 2 N/A 47°C N/A 5 18.3 W 667 MHz S.E.C.C.2 82°C 2 N/A 50°C N/A 5 17.5 W 667 MHz FC-PGA 82°C 2 N/A 50°C N/A 5 17.5 W 650 MHz S.E.C.C.2 82°C 2 N/A 53°C N/A 5 17.0 W 650 MHz FC-PGA 82°C 2 N/A 53°C N/A 5 17.0 W 600EB MHz S.E.C.C.2 82°C 2 N/A 48°C N/A 5 15.8 W 600EB MHz FC-PGA 82°C 2 N/A 48°C N/A 5 15.8 W 600E MHz S.E.C.C.2 82°C 2 N/A 48°C N/A 5 15.8 W 600E MHz FC-PGA 82°C 2 N/A 48°C N/A 5 15.8 W 600B MHz S.E.C.C.2 85°C 2 N/A 45°C 60°C 34.5 W 600 MHz S.E.C.C.2 85°C 2 N/A 45°C 60°C 34.5 W 550E MHz S.E.C.C.2 85°C 2 N/A 50°C N/A 5 14.5 W 550E MHz FC-PGA 85°C 2 N/A 50°C N/A 5 14.5 W 550 MHz S.E.C.C.2 80°C 2 N/A 45°C 60°C 30.8 W 533EB MHz S.E.C.C.2 82°C 2 N/A 50°C N/A 5 14.0 W 533EB MHz FC-PGA 82°C 2 N/A 50°C N/A 5 14.0 W 533B MHz S.E.C.C.2 90°C 2 N/A 47°C 61°C 29.7 W 500E MHz FC-PGA 85°C 2 N/A 53°C N/A 4 13.2 W 500 MHz S.E.C.C.2 90°C 2 N/A 50°C 62°C 28.0 W 450 MHz S.E.C.C.2 90°C 2 N/A 53°C 65°C 25.3 W

1. The maximum operating temperature and maximum power specification are specifications from the processor datasheet. The recommended fan inlet temperature (T_AM) and the recommended heatsink base temperature (T_HS) are not specification, see note 3 and 4. For more information on Pentium III processor specifications, see the Pentium III Processor Datasheet.
   
   
2. The junction temperature (T_J) can be determined using the thermal diode in the processor core. For more information, see the AP-905 Pentium III Processor Thermal Design Guidelines (order # 245087).
   
   
3. The recommended fan inlet temperature (T_A) should be measured at the inlet of the fan heatsink on the boxed processor (see Figure 1 and 3). This is a maximum value and a recommendation only, not a specification.
   
   
4. The recommended heatsink base temperature (T_HS) should be measured at the center of the top of the heatsink base near the processor markings (see Figure 1). This is a maximum value and a recommendation only, not a specification.
   
   
5. This method of validation is not appropriate for processors in the socketed form factor.
   
   
6. This part has a Vcc of 1.75 volts.
   
   
7. This processor is manufactured on the 0.13 micron process.

A simple evaluation of the temperature of the heatsink base can provide confidence in the system's thermal management. For boxed Pentium III processors in the S.E.C.C.2 form factor, the testing point is at the center of the heatsink base on the top of the processor near to the processor marking area (see Figure 1). The document titled Thermal Testing with Thermocouples and Thermal Meters on Intel Boxed Processor-Based Desktop PCs describes how to determine the temperature of this location while running a high power application. Using this evaluation, it is possible to determine if a system has sufficient thermal management for the boxed processor. A more general evaluation can be done by testing the temperature of the air entering the fan inlet. Table 1 contains the recommended temperature that the heatsink base test point or the air inlet temperature should remain below during the thermal evaluation of a system.

Figure 1. Temperature Test Locations for Boxed Pentium III Processors in the S.E.C.C.2 Form Factor

Figure 2. FC-PGA Boxed Pentium® III Processors Temperature Test
Locations

	Intel® Pentium® III Processor with 512-KB L2 Cache at 1.13GHz to 1.40 GHz Datasheet
	File Name: 24965705.pdf Size: 1817782 bytes

	Intel® Pentium® III Processor Based on 0.13 Micron Process Up to 1.33 GHz Datasheet
	File Name: 24976503.pdf Size: 1549807 bytes

Intel® Pentium® III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz

The Intel® Pentium® III processor for the PGA370 socket is the next member of the P6 family, in the Intel® IA-32 processor line and hereafter will be referred to as the Pentium® III processor, or simply the processor. The processor uses the same core and offers the same performance as the Intel Pentium III processor for the SC242 connector, but utilizes a package technology called flip-chip pin grid array, or FC-PGA. This package utilizes the same 370-pin zero insertion force socket (PGA370) used by the Intel® Celeron® processor. Thermal solutions are attached directly to the processor core package for FC-PGA and FC-PGA2.

	Intel® Pentium® III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
	File Name: 24526408.pdf Size: 1039043 bytes

	Intel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHz Datasheet
	File Name: 24445209.pdf Size: 1640152 bytes

Using Intel's advanced 0.13-micron process technology with copper interconnect, the Low Voltage (LV) Intel® Pentium® III processor 512-KB offers high-performance and low-power consumption. Key performance features include Internet Streaming SIMD instructions, an Advanced Transfer Cache architecture, and a processor system bus speed of up to 133 MHz. These features are offered in a Micro-FCBGA package for surface mount boards. All of these technologies make outstanding performance possible for applied computing applications.

This document provides the electrical, mechanical, and thermal specifications for the LV Intel Pentium III processor 512-KB in the Micro-FCBGA package at 1 GHz/133 MHz (1.15V), 933/133 MHz (1.15 V), and 800/133 MHz (1.15 V).

	Low Voltage Intel® Pentium® III Processor 512-KB
	File Name: 27367305.pdf Size: 1257656 bytes

Intel® Pentium® III Processors are specified to operate at the voltages provided in the table below. It is important to verify that the motherboard explicitly supports the specific processor (by stepping and speed).

Voltage requirements for Intel® Pentium III Processors

1. Note that 1 GHz = 1000 MHz.
2. This only affects processors with the s-spec, SL4WM. The SL4WM s-spec has a VID request of 1.70V, however, the processor should be supplied 1.76V at the PGA Vcc pins.
3. The -S version of the Pentium III processor requires VRM 8.5.

Proper voltage must be supplied for reliable operation. It may be supplied by a regulator integrated in the motherboard, or by a voltage regulator module (VRM) installed in Header 8 on the motherboard.

If the regulator is integrated in the motherboard, it must be Voltage ID (VID) programmable to allow the processor to program the correct voltage during power-on.

If the motherboard has Header 8, a VRM must be installed in the header to power the processor. Most VRMs are VID-programmable. If your motherboard has a fixed-voltage VRM, its output voltage must match the processor requirements.

Since the operating voltage of Intel® Pentium® III Processors may be changed as the processor goes through stepping changes, VID-programmable voltage regulators are the preferred solution. For complete voltage specifications for Intel® Pentium® III Processors, refer to the Intel® Pentium III Processor Datasheet for the appropriate package type of the processor.

Intel Corporation
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P.O. Box 58119
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Global Trade Department
e-mail inquiries to: ctp.determinations@intel.com

Following are the Gigaflops (GFLOPS), Composite Theoretical Performance (CTP), and Adjusted Peak Performance (APP) values for Intel’s 32-bit and 64-bit processors. All Intel® 8-bit and 16-bit processors and microcontrollers with a clock speed exceeding 25 MHz are 3A991, with the exception of those encapsulated in military packages that have been tested to the Mil-883C temperature specifications. All Intel 8-bit and 16-bit processors and microcontrollers with a clock speed of 25 MHz or less are EAR99.

On November 5, 2007, the United States Department of Commerce’s Bureau of Industry and Security (BIS) published amendments to the Export Administration Regulations 15 CFR, which resulted in the inclusion of the December 2006 Wassenaar Arrangement Plenary Agreement Implementation.

The amendments introduced a new metric, Gigaflops (GFLOPS), to measure processor performance for export purposes. BIS no longer requires exporters to determine the CTP. However, CTP values will still be provided for those customers located in countries where the CTP is still required as a measurement of processor performance for export compliance purposes.

CTP calculations are based upon a modified formula resulting from Wassenaar negotiations on December 21, 1993, and published in the United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4 for Category 4), and are stated in Millions of Theoretical Operations Per Second (MTOPS).

APP calculations are based on the formula published in the United States Department of Commerce Export Administration Regulations 71 CFR 20876, and are stated in Weighted Teraflops (WT).

All GFLOPS, CTP and APP calculations contained herein were based on specifications taken from Intel datasheets and are subject to change without notice. Intel makes no representation or warranty as to the accuracy or reliability of such specifications. THESE CALCULATIONS ARE PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. Intel disclaims all liability, including liability for infringement of any proprietary rights, relating to use of information in these calculations. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.

The following older processor families are no longer supported through interactive support such as phone, e-mail, or chat.

Intel will maintain information for these processors on our web site. You can access these processor family Web sites by clicking on the links under the processor column.

Floating Point Unit (FPU) exception hander information for Intel® processors is available in the following documents:

Application note AP-578, Software and Hardware Considerations for FPU Exception Handlers for Intel® Architecture Processors, Intel® Document #243291. This application note provides information to help software engineers write the most robust Floating-Point Unit (FPU) exception handlers possible.

Also see the Intel® Pentium® Processor Family Developer's Manual, Volume 3, Intel® Document #241430, contains three chapters about programming the floating point unit, including one chapter dedicated to programming examples.

Also see the Intel® Architecture Software Developer's Manual, Volume 1: Basic Architecture, Intel® Document #243190, Chapter 7 and Appendix C.

Intel® processors since the Intel386™ processor can run one of three modes. They are the Real mode, Protected mode and SMM mode. You can also add a fourth mode called Virtual 8088 mode, which is considered a pseudo mode of the protected mode.

When the processor starts booting the computer, the processor starts in real mode where it operates like a 8086 processor that can see up to 1 MB of RAM.

The native mode for the processor is the Protected mode which it will switch into while it loads Windows* or some other advanced operating system. While in protected mode, the processor uses segmented (non-linear) addressing, as opposed to linear addressing.

Segmented addressing means that memory (physical memory and virtual memory) is divided into 64K blocks. This is the maximum value for the Instruction Pointer (IP) register. The IP register works with the Code Segment (CS) register to point to the memory location from where the microprocessor should fetch its next instruction. The IP uses 4 bytes for memory addressing, therefore making 0FFFFH the maximum memory location (0FFFFH = 64K).

The links in the table take you to the Intel® Processor family. Here you can see processor specifications and do comparisons to other Intel® Processors.

If you click on a processor family and do not see your processor, try using the search box in the upper right corner of the screen. Click inside the search box for a list of search options.

To find information on all Intel products such ARK | Your source for information on Intel products.